Electronic device

ABSTRACT

An electronic device includes: a first substrate; a second substrate opposite to the first substrate; a black matrix layer disposed between the first and second substrates and including a first pixel region and a first shielding region disposed along a first direction, wherein the first pixel region includes a first sub-pixel opening; a scan line disposed between the first and second substrates and extending along a second direction different from the first direction, wherein the first shielding region overlaps the scan line; and a first color resist and a second color resist disposed in the fielding region, having different colors and overlapping each other to form an overlapping region, wherein a width of the overlapping region at the second direction is greater than or equal to 0 and less than 50% of a width of the first sub-pixel opening at the second direction.

CROSS REFERENCE TO RELATED APPLICATION

This application claims the benefits of the Chinese Patent ApplicationSerial Number 201910011183.X, filed on Jan. 7, 2019, the subject matterof which is incorporated herein by reference.

BACKGROUND 1. Field

The present disclosure provides an electronic device. More specifically,the present disclosure relates to an electronic device suitable for adisplay device with high resolution.

2. Description of Related Art

Display devices with high resolution are the mainstream display devicescommercially available. Many manufactures desires to develop displaydevices with higher resolution to improve the image quality.

For improving the resolution of the display devices, de-magnification ofthe sizes of the pixels is designed to provide clearer images. However,the requirement for materials is getting severe and the manufacturingcapacities and yields may not satisfy the manufacture's expectation whenthe sizes of the pixels are continuously reduced.

Therefore, it is desirable to provide a novel electronic device whichcan be applied to display devices to meet the requirement of highresolution.

SUMMARY

The present disclosure provides an electronic device, comprising: afirst substrate; a second substrate, opposite to the first substrate; ablack matrix layer disposed between the first substrate and the secondsubstrate and comprising a first pixel region and a first shieldingregion, wherein the first pixel region and the first shielding regionare disposed along a first direction, and the first pixel regioncomprises a first sub-pixel opening; a scan line disposed between thefirst substrate and the second substrate, wherein the scan line extendsalong a second direction, the first direction is different from thesecond direction, and the first shielding region overlaps the scan line;and a first color resist and a second color resist disposed in the firstshielding region, wherein a color of the first color resist is differentfrom a color of the second color resist, the first color resist overlapsthe second color resist in the first shielding region to form anoverlapping region, and a width of the overlapping region at the seconddirection is greater than or equal to 0 and less than 50% of a width ofthe first sub-pixel opening at the second direction.

The present disclosure further provides another electronic device,comprising: a first substrate; a second substrate, opposite to the firstsubstrate; a black matrix layer disposed between the first substrate andthe second substrate and comprising a first pixel region and a firstshielding region, wherein the first pixel region and the first shieldingregion are disposed along a first direction, and the first pixel regioncomprises a first sub-pixel opening; a scan line disposed between thefirst substrate and the second substrate, wherein the scan line extendsalong a second direction, the first direction is different from thesecond direction, and the first shielding region overlaps the scan line;and a first color resist disposed in the first shielding region, whereina width of the first color resist at the second direction is greaterthan or equal to 1.5 times of a width of the first sub-pixel opening atthe second direction.

Other novel features of the disclosure will become more apparent fromthe following detailed description when taken in conjunction with theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of an electronic device according toone embodiment of the present disclosure.

FIG. 2 is a schematic view showing a structure and a black matrix layeron a first substrate in an electronic device according to one embodimentof the present disclosure.

FIG. 3 is a schematic view showing a color resist layer in an electronicdevice according to one embodiment of the present disclosure.

FIG. 4 is an enlarge view of a part of a color resist layer shown inFIG. 3.

FIG. 5A to FIG. 5C are cross-sectional views according to the lines B-B′and C-C′ indicated in FIG. 4 respectively.

FIG. 6 is a schematic view showing a color resist layer in an electronicdevice according to another embodiment of the present disclosure.

FIG. 7 is a schematic view showing a color resist layer in an electronicdevice according to another embodiment of the present disclosure.

FIG. 8 is a schematic view showing a color resist layer in an electronicdevice according to another embodiment of the present disclosure.

FIG. 9 is a schematic view showing a color resist layer in an electronicdevice according to another embodiment of the present disclosure.

FIG. 10 is a schematic view showing a color resist layer in anelectronic device according to another embodiment of the presentdisclosure.

FIG. 11 is a schematic view showing a color resist layer in anelectronic device according to another embodiment of the presentdisclosure.

FIG. 12 is a schematic view showing a color resist layer in anelectronic device according to another embodiment of the presentdisclosure.

FIG. 13 is a schematic view showing a color resist layer in anelectronic device according to another embodiment of the presentdisclosure.

FIG. 14 is a schematic view showing a color resist layer in anelectronic device according to another embodiment of the presentdisclosure.

DETAILED DESCRIPTION OF EMBODIMENT

The following embodiments when read with the accompanying drawings aremade to clearly exhibit the above-mentioned and other technicalcontents, features and/or effects of the present disclosure. Through theexposition by means of the specific embodiments, people would furtherunderstand the technical means and effects the present disclosure adoptsto achieve the above-indicated objectives. Moreover, as the contentsdisclosed herein should be readily understood and can be implemented bya person skilled in the art, all equivalent changes or modificationswhich do not depart from the concept of the present disclosure should beencompassed by the appended claims.

Furthermore, the ordinals recited in the specification and the claimssuch as “first”, “second” and so on are intended only to describe theelements claimed and imply or represent neither that the claimedelements have any proceeding ordinals, nor that sequence between oneclaimed element and another claimed element or between steps of amanufacturing method. The use of these ordinals is merely todifferentiate one claimed element having a certain designation fromanother claimed element having the same designation.

Furthermore, the terms recited in the specification and the claims suchas “above”, “over”, or “on” are intended not only directly contact withthe other element, but also intended indirectly contact with the otherelement. Similarly, the terms recited in the specification and theclaims such as “below”, or “under” are intended not only directlycontact with the other element but also intended indirectly contact withthe other element.

Furthermore, when a value is in a range from a first value to a secondvalue, the value can be the first value, the second value, or anothervalue between the first value and the second value.

In addition, the features in different embodiments of the presentdisclosure can be mixed to form another embodiment.

FIG. 1 is a cross-sectional view of an electronic device according toone embodiment of the present disclosure. The electronic device of thepresent embodiment is a display device, comprising: a first substrate 1;a second substrate 2 opposite to the first substrate 1; a display layer3 disposed between the first substrate 1 and the second substrate 2; anda sealant 4 disposed between the first substrate 1 and the secondsubstrate 2 and adjacent to the display layer 3. Herein, the firstsubstrate 1 and the second substrate 2 can respectively be a rigidsubstrate, a flexible substrate, a film or a combination thereof. Thematerial of the first substrate 1 and the second substrate 2 mayrespectively comprise quartz, glass, silicon wafer, sapphire,polycarbonate (PC), polyimide (PI), polypropylene (PP), polyethyleneterephthalate (PET), other plastic or polymer matieral, or a combinationthereof; but the present disclousre is not limited thereto. When thefirst substrate 1 or the second substrate 2 is a film, the film can be abarrier film, or an encapsulating barrier film formed by laminatedinorganic-organic-inorganic insulating layers. In addition, the displaylayer 3 may comprise liquid crystals (LCs), organic light-emittingdiodes (OLEDs), quantum dots (QDs), fluorescence material, phosphormaterial, light-emitting diodes (LEDs) or other display medium; but thepresent disclosure is not limited thereto. The LEDs can comprise a microLED (micro light-emitting diode), a mini LED (mini light-emitting diode)according to the size thereof; or a quantum dot (QD) LED such as QLED orQDLED; but the present disclosure is not limtied thereto. The size ofthe mini LED can be in a range from about 100 μm to about 300 μm, andthe size of the micro LED can be in a range from about 1 μm to 100 μm;but the present disclousre is not limited thereto. The electronic deviceof the present embodiment can also be an antenna device, and the displaylayer can be replaced by a wavelength modulation medium which can beliquid crystals. In addition, the electronic device of the presentdisclosure can be a bendable or a flexible electronic device.Furthermore, the electronic device of the present disclosure can be atiled electronic device, which can be a tiled display device, a tiledantenna device or a combination thereof.

Not only the display layer 3 but also other structures can be disposedbetween the first substrate 1 and the second substrate 2. Hereinafter,other structures disposed between the first substrate 1 and the secondsubstrate 2 are described in detail with FIG. 2 to FIG. 4. FIG. 2 is aschematic view showing a structure and a black matrix layer on the firstsubstrate in the electronic device of the present embodiment. FIG. 3 isa schematic view showing a color resist layer in the electronic deviceof the present embodiment. FIG. 4 is an enlarge view of a part of thecolor resist layer shown in FIG. 3.

As shown in FIG. 2, in the electronic device of the present embodiment,the first substrate 1 can be a thin film transistor (TFT) substrate onwhich disposed with a scan line 11, a data line 12, a transistor 13electrically connecting to the scan line 11 and the data line 12, and apixel electrode 14 electrically connecting to the transistor 13. Asemiconductor layer included in the transistor 13 may comprise amorphoussilicon, polycrystalline-silicon, or metal oxide such as IGZO (indiumgallium zinc oxide), AIZO (aluminum indium zinc oxide), HIZO (hafniumindium zinc oxide), ITZO (indium tin zinc oxide), IGZTO (indium galliumzinc tin oxide), or IGTO (indium gallium tin oxide); but the presentdisclosure is not limited thereto. In addition, the scan line 11 and thedata line 12 may respectively comprise Cu, Al, Mo, W, Au, Cr, Ni, Pt,Ti, Cu alloy, Al alloy, Mo alloy, W alloy; Au alloy, Cr alloy, Ni alloy,Pt alloy, Ti alloy, other suitable metal, a combination thereof, orother conductive material with good conductivity or small resistance;but the present disclosure is not limited thereto. The pixel electrode14 may comprise transparent conductive metal oxide such as ITO (indiumtin oxide), IZO (indium zinc oxide), ITZO (indium tin zinc oxide), IGZO(indium gallium zinc oxide) or AZO (aluminum zinc oxide); but thepresent disclosure is not limited thereto.

In addition, in the electronic device of the present embodiment, a blackmatrix layer 21 can be disposed between the first substrate 1 and thesecond substrate 2, and comprises plural first pixel regions Rp1 andplural first shielding regions Rs1. The first pixel regions Rp1 and thefirst shielding regions Rs1 are alternately disposed along a firstdirection Y Herein, “the first pixel regions Rp1 and the first shieldingregions Rs1 are alternately disposed along a first direction Y” refersto the situation that one first pixel region Rp1 is disposed between twoadjacent first shielding regions Rs1, and no other first pixel regionRp1 is disposed between the two adjacent first shielding regions Rs1. Inaddition, the first pixel region Rp1 comprises a first sub-pixel opening211 to expose the pixel electrode 14.

As shown in FIG. 1 and FIG. 3, a color resist layer can be disposedbetween the first substrate 1 and the second substrate 2, and comprisespixel region color resists 22 and shielding region color resists 23. Thepixel region color resists 22 are disposed corresponding to the firstpixel region Rp1, and comprises a first pixel color resist 221, a secondpixel color resist 222 and a third pixel color resist 223. The shieldingregion color resists 23 are disposed corresponding to the firstshielding region Rs1, and comprises a first color resist 231, a secondcolor resist 232 and a fourth color resist 233.

FIG. 4 is an enlarge view of a part of the color resist layer shown inFIG. 3, and FIG. 5A is a cross-sectional view according to the line A-A′indicated in FIG. 4. Hereinafter, a relationship between the blackmatrix layer 21 and the color resist layer in the electronic device ofthe present embodiment are described with FIG. 4 accompanying with FIG.2 and FIG. 5A. The electronic device of the present embodimentcomprises: a first substrate 1 (as shown in FIG. 1); a second substrate2 (as shown in FIG. 1) opposite to the first substrate 1; a black matrixlayer 21 disposed between the first substrate 1 and the second substrate2 and comprising a first pixel region Rp1 and a first shielding regionRs1, wherein the first pixel region Rp1 and the first shielding regionRs1 are disposed alternately along a first direction Y, and the firstpixel region Rp1 comprises a first sub-pixel opening 211; a scan line 11disposed between the first substrate 1 and the second substrate 2,wherein the scan line 11 extends along a second direction X, the firstdirection Y is different from the second direction X, and the firstshielding region Rs1 overlaps the scan line 11; a first pixel colorresist 221 disposed corresponding to the first sub-pixel opening 211;and a first color resist 231 disposed in the first shielding region Rs1.In one embodiment, a width dx′ of the first color resist 231 at thesecond direction X can be greater than a width di of the first pixelcolor resist 221 at the second direction X, wherein the width d1 of thefirst pixel color resist 221 at the second direction X refers to adistance between two ends of the first pixel color resist 221 on theblack matrix layer 21 in a cross section along the second direction X,and the width dx′ of the first color resist 231 at the second directionX refers to a distance between two ends of the bottom of the first colorresist 231 in a cross section along the second direction X. In anotherembodiment, a width dx′ of the first color resist 231 at the seconddirection X can be greater than a width d2 of the first sub-pixelopening 211 at the second direction X, wherein the width d2 of the firstsub-pixel opening 211 refers to a distance between two ends of the firstsub-pixel opening 211 at the bottom of the first sub-pixel opening 211in a cross section along the second direction X. In the presentembodiment, a color of the first pixel color resist 221 is the same as acolor of the first color resist 231, and the first pixel color resist221 connects to the first color resist 231.

As the display device with high resolution becomes the mainstreamdisplay device in the market, the size of the first sub-pixel opening211 is getting smaller, and the size of the first pixel color resist 221is also getting smaller. The pigment contained in the first pixel colorresist 221 may absorb light, wherein the surface layer of the firstpixel color resist 221 absorb more exposure light, and the bottom layerof the first pixel color resist 221 absorb less exposure light. In thissituation, the photo color resist at the bottom layer of the first pixelcolor resist 221 may react incompletely because the exposure energyabsorbed by the bottom layer of the first pixel color resist 221 isinsufficient during the photolithography process, resulting in theadhesion decreased or the undercut. Thus, the first pixel color resist221 may be peeled off.

In the present embodiment, the width dx′ of the first color resist 231at the second direction X in the first shielding region Rs1 is designedto be greater than the width d1 of the first pixel color resist 221 atthe second direction X in the first pixel region Rp1, so that the areaof the first color resist 231 is increased. In another embodiment, thewidth dx′ of the first color resist 231 at the second direction X in thefirst shielding region Rs1 is designed to be greater than the width d2of the first sub-pixel opening 211 at the second direction X in thefirst pixel region Rp1, so that the area of the first color resist 231is increased. Because the color of the first pixel color resist 221 isthe same as the color of the first color resist 231 and the first pixelcolor resist 221 connects to the first color resist 231, the first pixelcolor resist 221 and the first color resist 231 can be formed at thesame time by a single opening of a mask. In the present embodiment, anopening area of the mask is increased as the area of the first colorresist 231 increased. When a photo color resist is used to form thefirst color resist 231 and the first pixel color resist 221, the totalexposure energy is increased as the total light amount is increased byenlarging the opening area of the mask. Thus, the photo color resist canreact completely, and the overall adhesion of the first color resist 231and the first pixel color resist 221 can further be improved. The firstcolor resist 231 can assist the fixing of the first pixel color resist221 because the color of the first pixel color resist 221 is the same asthe color of the first color resist 231 and the first pixel color resist221 connects to the first color resist 231. Meanwhile, the overalladhesion of the first color resist 231 and the first pixel color resist221 can be improved by increasing the adhesion area of the first colorresist 231. Even though the area of the first pixel color resist 221 issmall, the adhesion of the first color resist 231 with the larger areacan decrease the peeling possibility of the first pixel color resist221.

In the present disclosure, the width dx′ of the first color resist 231at the second direction X is designed to be greater than the width d1 ofthe first pixel color resist 221 at the second direction X or the widthd2 of the first sub-pixel opening 211 at the second direction X toachieve the aforesaid effect. In one embodiment of the presentdisclosure, the width dx′ of the first color resist 231 at the seconddirection X is greater than or equal to 1.5 times of the width d1 of thefirst pixel color resist 221 at the second direction X (dx′/d1≥1.5) andless than a width of the second substrate 2. In another embodiment, thewidth dx′ of the first color resist 231 at the second direction X can begreater than or equal to 1.5 times of the width d2 of the firstsub-pixel opening 211 at the second direction X (dx′/d2≥1.5) and lessthan the width of the second substrate 2. In the present embodiment, thewidth dx′ of the first color resist 231 at the second direction X isgreater than or equal to 2 times of the width d1 of the first pixelcolor resist 221 at the second direction X and less than the width ofthe second substrate 2. In another embodiment, the width dx′ of thefirst color resist 231 at the second direction X is greater than orequal to 2 times of the width d2 of the first sub-pixel opening 211 atthe second direction X and less than the width of the second substrate2. But, the present disclosure is not limited thereto.

As shown in FIG. 2 and FIG. 4, in the present embodiment, the firstpixel region Rp1 may further comprises a second sub-pixel opening 212,the second pixel color resist 222 is disposed corresponding to thesecond sub-pixel opening 212, a color of the second pixel color resist222 is the same as the color of the second color resist 232, the secondpixel color resist 222 connects to the second color resist 232, and awidth dx′ of the second color resist 232 at the second direction X isgreater than a width d1 of the second pixel color resist 222 at thesecond direction X. In addition, the feature of the second sub-pixelopening 212 can be the same as the feature of the first sub-pixelopening 211, i.e. a width dx′ of the second color resist 232 at thesecond direction X is greater than a width d2 of the second sub-pixelopening 212 at the second direction X. The width d2 of the secondsub-pixel opening 212 is not shown in the figure, but can be referred tothe width d2 of the first sub-pixel opening 211 shown in FIG. 5A. Inanother embodiment, the width dx′ of the second color resist 232 at thesecond direction X can be greater than or equal to 1.5 times of thewidth d2 of the second sub-pixel opening 212 at the second direction X.In addition, the first pixel region Rp1 may further comprises a thirdsub-pixel opening 213, the third pixel color resist 223 is disposedcorresponding to the third sub-pixel opening 213, a color of the thirdpixel color resist 223 is the same as the color of the fourth colorresist 233, the third pixel color resist 223 connects to the fourthcolor resist 233, and a width dx′ of the fourth color resist 233 at thesecond direction X is greater than a width d1 of the third pixel colorresist 223 at the second direction X. In addition, the feature of thethird sub-pixel opening 213 can be the same as the feature of the firstsub-pixel opening 211, i.e. a width dx′ of the fourth color resist 233at the second direction X is greater than a width d2 of the thirdsub-pixel opening 213 at the second direction X. The width d2 of thethird sub-pixel opening 213 is not shown in the figure, but can bereferred to the width d2 of the first sub-pixel opening 211 shown inFIG. 5A. In another embodiment, the width dx′ of the fourth color resist233 at the second direction X can be greater than or equal to 1.5 timesof the width d2 of the third sub-pixel opening 213. In the presentembodiment, the relation between the second pixel color resist 222 andthe second color resist 232 and/or the relation between the third pixelcolor resist 223 and the fourth color resist 233 can be the same as orsimilar to the relation between the first pixel color resist 221 and thefirst color resist 231, and is not repeated again.

In addition, as shown in FIG. 2 and FIG. 4, the disposition position ofthe first color resist 231, the second color resist 232 and the fourthcolor resist 233 of the first shielding region Rs1 cannot be exposedfrom the first sub-pixel opening 211, the second sub-pixel opening 212and the third sub-pixel opening 213. In other words, a width dy′ of thefirst color resist 231, the second color resist 232 and the fourth colorresist 233 of the first shielding region Rs1 at the first direction Yhas to be equal to or smaller than a width D_(BM) of the first shieldingregion Rs1 at the first direction Y (dy′≤D_(BM)).

In the present embodiment, the first pixel color resist 221 and thefirst color resist 231 are red color resists, the second pixel colorresist 222 and the second color resist 232 are green color resists, andthe third pixel color resist 223 and the fourth color resist 233 areblue color resists; but the present disclosure is not limited thereto.The first pixel color resist 221 and the first color resist 231 have thesame color, the second pixel color resist 222 and the second colorresist 232 have the same color, the third pixel color resist 223 and thefourth color resist 233 have the same color, the first pixel colorresist 221, the second pixel color resist 222 and the third pixel colorresist 223 have different colors, and the first color resist 231, thesecond color resist 232 and the fourth color resist 233 have differentcolors,

FIG. 5A to FIG. 5C are cross-sectional views according to the linesA-A′, B-B′ and C-C′ indicated in FIG. 4 respectively. As shown in FIG.5A, in the electronic device of the present embodiment, the first pixelcolor resist 221, the second pixel color resist 222 and the third pixelcolor resist 223 are disposed on the second substrate 2, and the blackmatrix layer 21 is also disposed on the second substrate 2. The firstpixel region Rp1 of the black matrix layer 21 is disposed between thefirst pixel color resist 221 and the second pixel color resist 222,between the second pixel color resist 222 and the third pixel colorresist 223, and also between the first pixel color resist 221 and thethird pixel color resist 223. In addition, the first pixel color resist221, the second pixel color resist 222 and the third pixel color resist223 may cover a part of the first pixel region Rp1. In anotherembodiment of the present disclosure, the first pixel color resist 221,the second pixel color resist 222 and the third pixel color resist 223may not cover the first shielding region Rs1. In further anotherembodiment of the present disclosure, in the first pixel region Rp1, thefirst pixel color resist 221 and the second pixel color resist 222 canbe overlapped, the second pixel color resist 222 and the third pixelcolor resist 223 can be overlapped, or the first pixel color resist 221and the third pixel color resist 223 can be overlapped. In addition, thefirst pixel color resist 221 and the second pixel color resist 222 canbe overlapped along the first direction Y or the second direction X.But, the present disclosure is not limited thereto.

As shown in FIG. 5B, in the electronic device of the present embodiment,the first color resist 231, the second color resist 232 (as shown inFIG. 4) and the fourth color resist 233 are also disposed on the secondsubstrate 2. The first color resist 231, the second color resist 232 andthe fourth color resist 233 are disposed in the first shielding regionRs1. The color of the first color resist 231 is different from the colorof the second color resist 232, and the first color resist 231 overlapsthe second color resist 232 in the first shielding region Rs1 to form anoverlapping region R. As shown in FIG. 5A and FIG. 5B, a width w of theoverlapping region R at the second direction X is greater than or equalto 0 and less than 50% of the width d1 (shown in FIG. 5A) of the firstpixel color resist 221 at the second direction X. In another embodiment,the width w of the overlapping region R at the second direction X isgreater than or equal to 0 and less than 50% of the width d2 (shown inFIG. 5A) of the first sub-pixel opening 211 at the second direction X.FIG. 5B is provided as an example, in which the width w of theoverlapping region R refers to a distance between a end of the firstcolor resist 231 to an end of the fourth color resist 233 at the seconddirection X. More specifically, the width w is greater than or equal to0% of the width d1 and less than 50% of the width di(0%≤(w/d1)×100%<50%), the width w is greater than or equal to 0% of thewidth d1 and less than 40% of the width d1 (0%≤(w/d1)×1.00%<40%), thewidth w is greater than or equal to 0% of the width d1 and less than 30%of the width d1 (0%≤(w/d1)×100%<30%), the width w is greater than orequal to 0% of the width d1 and less than 20% of the width d1(0%≤(w/d1)×100%<20%), or the width w is greater than or equal to 0% ofthe width d1 and less than 10% of the width d1 (0%≤(w/d1)×100%<10%). Inanother embodiment, the width w of the overlapping region R at thesecond direction X can be greater than or equal to 0 and less than 50%of the width d2 (as shown in FIG. 5A) of the first sub-pixel opening 211at the second direction X. More specifically, the width w is greaterthan or equal to 0% of the width d2 and less than 50% of the width d2(0%≤(w/d2)×100%<50%), the width w is greater than or equal to 0% of thewidth d2 and less than 40% of the width d2 (0%≤(w/d2)×100%<40%), thewidth w is greater than or equal to 0% of the width d2 and less than 30%of the width d2 (0%≤(w/d2)×100%<30%), the width w is greater than orequal to 0% of the width d2 and less than 20% of the width d2(0%≤(w/d2)×100%<20%), or the width w is greater than or equal to 0% ofthe width d2 and less than 10% of the width d2 (0%≤(w/d2)×100%<10%).Even not shown in the figure, two adjacent first color resist 231 andsecond color resist 232 or two adjacent second color resist 232 andfourth color resist 233 can be overlapped in the first shielding regionRs1 to form another overlapping region. The relation between the width wof this overlapping region and the width d1 or between the width w ofthis overlapping region and the width d2 are similar to that describedabove, and is not repeated again.

In the present embodiment, because the first color resist 231, thesecond color resist 232 and the fourth color resist 233 are disposed inthe first shielding region Rs1, the color mixing problem is not occurredeven though the first color resist 231, the second color resist 232 andthe fourth color resist 233 are overlapped. When two adjacent firstcolor resist 231 and second color resist 232 are overlapped, twoadjacent second color resist 232 and fourth color resist 233 areoverlapped or two adjacent first color resist 231 and fourth colorresist 233 are overlapped, the adhesion between the color resists can beimproved by the partial overlapping of two adjacent color resists. Thus,the peeling problem of the color resists can be prevented.

As shown in FIG. 5C, the first pixel color resist 221 and the firstcolor resist 231 are adjacent and have the same color, so the firstcolor resist 231 can assist the fixing of the first pixel color resist221 to reduce the peeling probability of the first pixel color resist221. Similarly, even not shown in the figure, in other cross section ofthe present embodiment, the second pixel color resist 222 and the secondcolor resist 232 are adjacent and have the same color and the thirdpixel color resist 223 and the fourth color resist 233 are adjacent andhave the same color, so the peeling probability of the second pixelcolor resist 222 and the third pixel color resist 223 can also bereduced.

FIG. 6 is a schematic view showing a color resist layer in an electronicdevice according to another embodiment of the present disclosure. Theelectronic device of the present embodiment is similar to that shown inFIG. 3, except for the pattern of the color resist layer.

In the present embodiment, the color resists of the first shieldingregion Rs1 only comprise the first color resist 231 and the second colorresist 232. The first color resist 231 and the first pixel color resist221 have the same color and connect to each other. The width dx′ of thefirst color resist 231 at the second direction X is 4 times of the widthd1 of the first pixel color resist 221 at the second direction X. Thesecond color resist 232 and the second pixel color resist 222 have thesame color and connect to each other. The width dx′ of the second colorresist 232 at the second direction X is 2 times of the width d1 of thesecond pixel color resist 222 at the second direction X. In addition,the width dx′ of the first color resist 231 at the second direction Xcan also be 4 times of the width d2 of the first sub-pixel opening 211at the second direction X, and the width dx′ of the second color resist232 at the second direction X can also be 2 times of the width d2 of thesecond sub-pixel opening 212 at the second direction X.

Furthermore, in the present embodiment, the black matrix layer (notshown in the figure) further comprise a second shielding region Rs2, andthe first shielding region Rs1, the first pixel region Rp1 and thesecond shielding region Rs2 are disposed alternately along the firstdirection and the first pixel region Rp1 is disposed between the firstshielding region Rs1 and the second shielding region Rs2. The electronicdevice of the present embodiment further comprises a third color resist234 disposed in the second shielding region Rs, a color of the thirdcolor resist 234 is the same as the color of the first pixel colorresist 221, the third color resist 234 connects to the first pixel colorresist 221, and a width dx′ of the third color resist 234 at the seconddirection X is greater than the width d1 of the first pixel color resist221 at the second direction X. For example, the width dx′ of the thirdcolor resist 234 at the second direction X is greater than or equal to1.5 times of the width d1 of the first pixel color resist 221 at thesecond direction X. In the present embodiment, the width dx′ of thethird color resist 234 at the second direction X is 2 times of the widthd1 of the first pixel color resist 221 at the second direction X. Inanother embodiment, the width dx′ of the third color resist 234 at thesecond direction X can be greater than the width d2 of the firstsub-pixel opening 211 at the second direction X. For example, the widthdx′ of the third color resist 234 at the second direction X is greaterthan or equal to 1.5 times of the width d2 of the first sub-pixelopening 211 at the second direction X. In the present embodiment, thewidth dx′ of the third color resist 234 at the second direction X is 2times of the width d2 of the first sub-pixel opening 211 at the seconddirection X.

In the present embodiment, for the first pixel color resist 221, thefirst shielding region Rs1 and the second shielding region Rs2 at twosides of the first pixel color resist 221 are respectively disposed withthe first color resist 231 and the third color resist 234, which havethe same color as the first pixel color resist 221 and connects to thefirst pixel color resist 221. Hence, the first color resist 231 and thethird color resist 234 disposed at two sides of the first pixel colorresist 221 can assist the fixing of the first pixel color resist 221 toreduce the peeling probability of the first pixel color resist 221.Similarly, the design of the second pixel color resist 222 is the sameas that of the first pixel color resist 221, and is not repeated again.In the present embodiment, the first pixel color resist 221, the firstcolor resist 231 and the third color resist 234 are red color resists,the second pixel color resist 222 and the second color resist 232 aregreen color resists, and the third pixel color resist 223 is a bluecolor resist. But, the present disclosure is not limited thereto.

FIG. 7 is a schematic view showing a color resist layer in an electronicdevice according to another embodiment of the present disclosure. Theelectronic device of the present embodiment is similar to that shown inFIG. 6, except for the pattern of the color resist layer. In the presentembodiment, the overall adhesion of the first pixel color resist 221 canbe improved by the first color resist 231, and the overall adhesion ofthe second pixel color resist 222 can be improved by the second colorresist 232. Thus, the peeling probability of the first pixel colorresist 221 and the second pixel color resist 222 can be reduced. Eventhough the area of the first pixel color resist 221 is small, theadhesion of the first pixel color resist 221 can be increased byincreasing the color resist area with the first color resist 231 havinglarger adhesion area, so that the peeling probability of the first pixelcolor resist 221 can be reduced. Similarly, even though the area of thesecond pixel color resist 222 is small, the adhesion of the second pixelcolor resist 222 can be increased by increasing the color resist areawith the second color resist 232 having larger adhesion area, so thatthe peeling probability of the second pixel color resist 222 can bereduced.

In the present embodiment, the widths dx′ of the first color resist 231and the third color resist 234 at the second direction X are 1.5 timesof the width d1 of the first pixel color resist 221 at the seconddirection X, and the width dx′ of the second color resist 232 at thesecond direction X is 1.5 tunes of the width d1 of the second pixelcolor resist 222 at the second direction X. In another embodiment, thewidths dx′ of the first color resist 231 and the third color resist 234at the second direction X are 1.5 times of the width d2 of the firstsub-pixel opening 211 at the second direction X, and the width dx′ ofthe second color resist 232 at the second direction X is 1.5 times ofthe width d2 of the second sub-pixel opening 212 at the second directionX.

FIG. 8 is a schematic view showing a color resist layer in an electronicdevice according to another embodiment of the present disclosure. Theelectronic device of the present embodiment is similar to that shown inFIG. 7, except for the pattern of the color resist layer. In the presnetembodiment, the overall adhesion of the first pixel color resist 221 canbe improved by the first color resist 231, and the overall adhesion ofthe third pixel color resist 223 can be improved by the second colorresist 232. Thus, the peeling probability of the first pixel colorresist 221 and the second pixel color resist 223 can be reduced. Eventhough the area of the first pixel color resist 221 is small, theadhesion of the first pixel color resist 221 can be improved byincreasing the color resist area with the first color resist 231 havinglarger adhesion area, so that the peeling probability of the first pixelcolor resist 221 can be reduced. Similarly, even though the area of thesecond pixel color resist 222 is small, the adhesion of the second pixelcolor resist 222 can be improved by increasing the color resist areawith the second color resist 232 having larger adhesion area, so thatthe peeling probability of the second pixel color resist 222 can bereduced.

In FIG. 7, the first color resist 231 is a red color resist and thesecond color resist 232 is a green color resist. The first pixel colorresist 221 is a red color resist, the second pixel color resist 222 is agreen color resist and the third pixel color resist 223 is a blue colorresist.

In the present embodiment, as shown in FIG. 8, the first color resist231 is a green color resist and the second color resist 232 is a bluecolor resist. The first pixel color resist 221 is a green color resist,the second pixel color resist 222 is a blue color resist and the thirdpixel color resist 223 is a red color resist. But, the presentdisclousre is not limited thereto.

FIG. 9 is a schematic view showing a color resist layer in an electronicdevice according to another embodiment of the present disclosure. Theelectronic device of the present embodiment is similar to that shown inFIG. 6, except for the pattern of the color resist layer. When the firstpixel color resist 221 has to have larger adhesion than the third pixelcolor resist 223 due to the material property of the first pixel colorresist 221, even though the area of the first pixel color resist 221 issmall, the adhesion of the first pixel color resist 221 can be improvedby increasing the color resist area with the first color resist 231having larger adhesion area, so that the peeling probability of thefirst pixel color resist 221 can be reduced. Similarly, when the secondpixel color resist 222 has to have larger adhesion than the third pixelcolor resist 223 due to the material property of the second pixel colorresist 222, even though the area of the second pixel color resist 222 issmall, the adhesion of the second pixel color resist 222 can be improvedby increasing the color resist area with the second color resist 232having larger adhesion area, so that the peeling probability of thesecond pixel color resist 222 can be reduced.

In the present embodiment, the width dx′ of the first color resist 231at the second direction X is 2 times of the width d1 of the first pixelcolor resist 221 at the second direction X, but the width dx′ of thesecond color resist 232 at the second direction X is the same as thewidth d1 of the second pixel color resist 222 at the second direction X.In addition, the width dx′ of the third color resist 234 at the seconddirection X is 2 times of the width d1 of the first pixel color resist221 at the second direction X. In another embodiment, the width dx′ ofthe first color resist 231 at the second direction X can be 2 times ofthe width d2 of the first sub-pixel opening 211 at the second directionX, but the width dx′ of the second color resist 232 at the seconddirection X can be the same as the width d2 of the second sub-pixelopening 212 at the second direction X. In addition, the width dx′ of thethird color resist 234 at the second direction X can be 2 times of thewidth d2 of the first sub-pixel opening 211 at the second direction X.

In the present embodiment, the arrangement of the first color resist231, the second color resist 232 and the third color resist 234 ismismatched the arrangement of the first pixel color resist 221 and thesecond pixel color resist 222. In the present embodiment, even thoughthe color resists in the first pixel region Rp1 are disposed to mismatchthe color resists in the first shielding region Rs1 and the secondshielding region Rs2, two sides of the first pixel color resist 221 aredisposed with the first color resist 231 in the first shielding regionRs1 and the third color resist 234 in the second shielding region Rs2,wherein the first color resist 231 and the third color resist 234 havethe same color as the first pixel color resist 221 and connect to thefirst pixel color resist 221. In addition, the areas of the first colorresist 231 and the third color resist 234 are larger than the area ofthe first pixel color resist 221. Hence, the peeling probability of thefirst pixel color resist 221 can also be reduced.

in the present embodiment, the first color resist 231 and the thirdcolor resist 234 are green color resists, and the second color resist232 is a red color resist. The first pixel color resist 221 is a greencolor resist, the second pixel color resist 222 is a red color resistand the third pixel color resist 223 is a blue color resist. But, thepresent dislcosure is not limited thereto.

FIG. 10 is a schematic view showing a color resist layer in anelectronic device according to another embodiment of the presentdisclosure. The electronic device of the present embodiment is similarto that shown in FIG. 6, except for the pattern of the color resistlayer. When the first pixel color resist 221 has to have larger adhesionthan the second pixel color resist 222 due to the material property ofthe first pixel color resist 221, even though the area of the firstpixel color resist 221 is small, the adhesion of the first pixel colorresist 221 can be improved by increasing the color resist area with thefirst color resist 231 having larger adhesion area, so that the peelingprobability of the first pixel color resist 221 can be reduced.

In the present embodiment, the color resist in the first shieldingregion Rs1 only comprises the first color resist 231. The first colorresist 231 and the first pixel color resist 221 have the same color andconnect to each other. The width of the first color resist 231 at thesecond direction X is dozens, hundreds, thousands or more times of thewidth d1 of the first pixel color resist 221 at the second direction Xdepending upon the size of the electronic device; or the width of thefirst color resist 231 at the second direction X is dozens, hundreds,thousands or more times of the width d2 of the first sub-pixel opening211 at the second direction X depending upon the size of the electronicdevice.

In addition, the third color resist 234 in the second shielding regionRs2 and the first pixel color resist 221 are also have the same colorand connects to each other. The width of the third color resist 234 atthe second direction X is dozens, hundreds, thousands or more times ofthe width d1 of the first pixel color resist 221 at the second directionX depending upon the size of the electronic device; or the width of thethird color resist 234 at the second direction X is dozens, hundreds,thousands or more times of the width d2 of the first sub-pixel opening211 at the second direction X depending upon the size of the electronicdevice.

In the present embodiment, the first color resist 231 and the thirdcolor resist 234 are green color resists. The first pixel color resist221 is a green color resist, the second pixel color resist 222 is a redcolor resist and the third pixel color resist 223 is a blue colorresist. But, the present dislcosure is not limited thereto.

FIG. 11 is a schematic view showing a color resist layer in anelectronic device according to another embodiment of the presentdisclosure. The electronic device of the present embodiment is similarto that shown in FIG. 10, except for the pattern of the color resistlayer. When the first pixel color resist 221 has to have larger adhesionthan the second pixel color resist 222 due to the material property ofthe first pixel color resist 221, even though the area of the firstpixel color resist 221 is small, the adhesion of the first pixel colorresist 221 can be improved by increasing the color resist area with thefirst color resist 231 having larger adhesion area, so that the peelingprobability of the first pixel color resist 221 can be reduced.Similarly, when the second pixel color resist 222 has to have largeradhesion than the third pixel color resist 223 due to the materialproperty of the second pixel color resist 222, even though the area ofthe second pixel color resist 222 is small, the adhesion of the secondpixel color resist 222 can be improved by increasing the color resistarea with the second color resist 232 having larger adhesion area, sothat the peeling probability of the second pixel color resist 222 can bereduced.

In the presnet embodiment, the first color resist 231 has a repeatedcross type. The color resist in the first shielding region Rs1 comprisesnot only the first color resist 231 but also the second color resist232. Herein, the width dx′ of the second color resist 232 at the seconddirection X is 2 times of the width d1 of the second pixel color resist222 at the second direction X. In another embodiment, the width dx′ ofthe second color resist 232 at the second direction X can be 2 times ofthe width d2 of the second sub-pixel opening 212 at the second directionX. But, the present disclosure is not limited thereto. In addition, thepattern of the second shielding region Rs2 is the same as the pattern ofthe first shielding region Rs1.

In the present embodiment, the first pixel color resist 221 and thefirst color resist 231 are red color resists, the second pixel colorresist 222 and the second color resist 232 are green color resists, andthe third pixel color resist 223 is a blue color resist. But, thepresent dislcosure is not limited thereto.

FIG. 12 is a schematic view showing a color resist layer in anelectronic device according to another embodiment of the presentdisclosure. The electronic device of the present embodiment is similarto that shown in FIG. 11, except for the pattern of the color resistlayer. When the first pixel color resist 221 has to have larger adhesionthan the second pixel color resist 222 due to the material property ofthe first pixel color resist 221, even though the area of the firstpixel color resist 221 is small, the adhesion of the first pixel colorresist 221 can be improved by increasing the color resist area withplural first color resists 231 connecting to each other to form a griddistribution, so that the peeling probability of the first pixel colorresist 221 can be reduced. Similarly, when the second pixel color resist222 has to have larger adhesion than the third pixel color resist 223due to the material property of the second pixel color resist 222, eventhough the area of the second pixel color resist 222 is small, theadhesion of the second pixel color resist 222 can be improved byincreasing the color resist area with the second color resist 232 havinglarger adhesion area, so that the peeling probability of the secondpixel color resist 222 can be reduced.

In the present embodiment, the arrangement of the first color resist 231and the second color resist 232 is mismatched the arrangement of thefirst pixel color resist 221 and the second pixel color resist 222. Thefirst color resist 231 and the first pixel color resist 221 still havethe same color and connect to each other, and the second color resist232 and the second pixel color resist 222 also have the same color andconnect to each other.

FIG. 13 is a schematic view showing a color resist layer in anelectronic device according to another embodiment of the presentdisclosure. The electronic device of the present embodiment is similarto that shown in FIG. 10, except for the pattern of the color resistlayer. When the first pixel color resist 221 has to have larger adhesiondue to the material property of the first pixel color resist 221, eventhough the area of the first pixel color resist 221 is small, theadhesion of the first pixel color resist 221 can be improved byincreasing the color resist area with the first color resist 231 havinglarger adhesion area, so that the peeling probability of the first pixelcolor resist 221 can be reduced.

In the present embodiment, the pixel region color resists 22 furthercomprises a fourth pixel color resist 224. Herein, the fourth pixelcolor resist 224 is a transparent color resist, but the presentdisclosure is not limited thereto.

FIG. 14 is a schematic view showing a color resist layer in anelectronic device according to another embodiment of the presentdisclosure. The electronic device of the present embodiment is similarto that shown in FIG. 7, except for the pattern of the color resistlayer. When the first pixel color resist 221 has to have larger adhesionthan the third pixel color resist 223 due to the material property ofthe first pixel color resist 221, even though the area of the firstpixel color resist 221 is small, the adhesion of the first pixel colorresist 221 can be improved by increasing the color resist area with thefirst color resist 231 having larger adhesion area, so that the peelingprobability of the first pixel color resist 221 can be reduced.Similary, when the second pixel color resist 222 has to have largeradhesion than the third pixel color resist 223 due to the materialproperty of the second pixel color resist 222, even though the area ofthe second pixel color resist 222 is small, the adhesion of the secondpixel color resist 222 can be improved by increasing the color resistarea with the second color resist 232 having larger adhesion area, sothat the peeling probability of the second pixel color resist 222 can bereduced.

In the present embodiment, the pixel region color resists 22 furthercomprises a fourth pixel color resist 224. Herein, the fourth pixelcolor resist 224 is a transparent color resist, but the presentdisclosure is not limited thereto.

In addition, in the present embodiment, the width dx′ of the first colorresist 231 at the second direction X is 2 times of the width d1 of thefirst pixel color resist 221 at the second direction X, and the widthdx′ of the second color resist 232 at the second direction X is 2 timesof the width d1 of the second pixel color resist 222 at the seconddirection X In another embodiment, the width dx′ of the first colorresist 231 at the second direction X is 2 times of the width d2 of thefirst sub-pixel opening 211 at the second direction X, and the width dx′of the second color resist 232 at the second direction X is 2 times ofthe width d2 of the second sub-pixel opening 212 at the second directionX.

In other embodiment of the present disclosure, the arrangements of thefirst pixel color resist 221, the second pixel color resist 222, thethird pixel color resist 223 and the fourth pixel color resist 224 arenot limited to those shown in the aforesaid embodiments, as long as thecolor resists in the pixel regions and the shielding regions have theaforesaid features.

In addition, in other embodiment of the present disclosure, the colorsof the pixel color resists in the pixel regions and the color resists inthe shielding regions are not limited to those described in theaforesaid embodiments, and can be modified according to the requirementfor the electronic device. In one embodiment of the present disclosure,the color resists in the shielding region may only comprise green colorresists. In another embodiment of the present disclosure, the colorresists in the shielding region may comprise red and green colorresists. In further another embodiment of the present disclosure, thecolor resists in the shielding region may comprise red, green and bluecolor resists. However, the present disclosure is not limited thereto,and the color of the color resists in the shielding region can bemodified according to the manufacturing process, color resist materialor arrangements of the color resists.

Furthermore, in other embodiments of the present disclosure, the widthsof the color resists in the shielding region are not limited to thosedescribed in the aforesaid embodiments and can be modified according tothe requirement for the electronic device, as long as a width of onecolor resist in a shielding region is 1.5 times or more of a width of apixel color resist or a width of a sub-pixel opening corresponding tothe pixel color resist in a pixel region (in which the pixel colorresist in the pixel region and the color resist in the shielding regionare adjacent and have the same color) and less than a width of thesecond substrate.

Although the present disclosure has been explained in relation to itsembodiment, it is to be understood that many other possiblemodifications and variations can be made without departing from thespirit and scope of the disclosure as hereinafter claimed. The featuresof the aforesaid embodiments can be combined to each other if noconflict is occurred.

What is claimed is:
 1. An electronic device, comprising: a firstsubstrate; a second substrate, opposite to the first substrate; a blackmatrix layer disposed between the first substrate and the secondsubstrate and comprising a first pixel region and a first shieldingregion, wherein the first pixel region and the first shielding regionare disposed along a first direction, and the first pixel regioncomprises a first sub-pixel opening; a scan line disposed between thefirst substrate and the second substrate, wherein the scan line extendsalong a second direction, the first direction is different from thesecond direction, and the first shielding region overlaps the scan line;and a first color resist and a second color resist disposed in the firstshielding region, wherein a color of the first color resist is differentfrom a color of the second color resist, the first color resist overlapsthe second color resist in the first shielding region to form anoverlapping region, and a width of the overlapping region at the seconddirection is greater than or equal to 0 and less than 50% of a width ofthe first sub-pixel opening at the second direction.
 2. The electronicdevice of claim 1, further comprising a first pixel color resistdisposed corresponding to the first sub-pixel opening, wherein a widthof the first color resist at the second direction is greater than thewidth of the first sub-pixel opening at the second direction.
 3. Theelectronic device of claim 2, wherein the width of the first colorresist at the second direction is greater than or equal to 1.5 times ofthe width of the first sub-pixel opening at the second direction andless than a width of the second substrate.
 4. The electronic device ofclaim 2, wherein a color of the first pixel color resist is the same asthe color of the first color resist, and the first pixel color resistconnects to the first color resist.
 5. The electronic device of claim 4,further comprising a second pixel color resist, wherein the first pixelregion further comprises a second sub-pixel opening, the second pixelcolor resist is disposed corresponding to the second sub-pixel opening,a color of the second pixel color resist is the same as the color of thesecond color resist, the second pixel color resist connects to thesecond color resist, and a width of the second color resist at thesecond direction is greater than a width of the second sub-pixel openingat the second direction.
 6. The electronic device of claim 5, whereinthe width of the second color resist at the second direction is greaterthan or equal to 1.5 times of the width of the second sub-pixel openingat the second direction and less than a width of the second substrate.7. The electronic device of claim 4, wherein the black matrix layerfurther comprises a second shielding region, the first shielding region,the first pixel region and the second shielding region are disposedalternately along the first direction, and the first pixel region isdisposed between the first shielding region and the second shieldingregion, wherein the electronic device further comprises a third colorresist disposed in the second shielding region, a color of the thirdcolor resist is the same as the color of the first pixel color resist,the third color resist connects to the first pixel color resist, and awidth of the third color resist at the second direction is greater thanthe width of the first sub-pixel opening at the second direction.
 8. Theelectronic device of claim 7, wherein the width of the third colorresist at the second direction is greater than or equal to 1.5 times ofthe width of the first sub-pixel opening at the second direction andless than a width of the second substrate.
 9. The electronic device ofclaim 1, wherein the black matrix layer comprises plural first pixelregions and plural first shielding regions alternately disposed alongthe first direction.
 10. The electronic device of claim 1, wherein awidth of the first color resist and a width of the second color resistat the first direction is equal to or smaller than a width of the firstshielding region at the first direction.
 11. An electronic device,comprising: a first substrate; a second substrate, opposite to the firstsubstrate; a black matrix layer disposed between the first substrate andthe second substrate and comprising a first pixel region and a firstshielding region, wherein the first pixel region and the first shieldingregion are disposed along a first direction, and the first pixel regioncomprises a first sub-pixel opening; a scan line disposed between thefirst substrate and the second substrate, wherein the scan line extendsalong a second direction, the first direction is different from thesecond direction, and the first shielding region overlaps the scan line;and a first color resist disposed in the first shielding region, whereina width of the first color resist at the second direction is greaterthan or equal to 1.5 times of a width of the first sub-pixel opening atthe second direction.
 12. The electronic device of claim 11, wherein thewidth of the first color resist at the second direction is greater thanor equal to 1.5 times of the width of the first sub-pixel opening at thesecond direction and less than a width of the second substrate.
 13. Theelectronic device of claim 11, further comprising a first pixel colorresist disposed corresponding to the first sub-pixel opening, whereinthe width of the first color resist at the second direction is greaterthan or equal to 2 times of the width of the first sub-pixel opening atthe second direction and less than a width of the second substrate. 14.The electronic device of claim 13, wherein a color of the first pixelcolor resist is the same as a color of the first color resist, and thefirst pixel color resist connects to the first color resist.
 15. Theelectronic device of claim 14, further comprising a second pixel colorresist and a second color resist, wherein the first pixel region furthercomprises a second sub-pixel opening, the second pixel color resist isdisposed corresponding to the second sub-pixel opening, the second colorresist is disposed in the first shielding region, a color of the secondpixel color resist is the same as a color of the second color resist,the second pixel color resist connects to the second color resist, and awidth of the second color resist at the second direction is greater thanor equal to 1.5 times of a width of the second sub-pixel opening at thesecond direction.
 16. The electronic device of claim 15, wherein thewidth of the second color resist at the second direction is greater thanor equal to 1.5 times of the width of the second sub-pixel opening atthe second direction and less than a width of the second substrate. 17.The electronic device of claim 15, wherein the black matrix layerfurther comprises a second shielding region, the first shielding region,the first pixel region and the second shielding region are disposedalternately along the first direction, and the first pixel region isdisposed between the first shielding region and the second shieldingregion, wherein the electronic device further comprises a third colorresist disposed in the second shielding region, a color of the thirdcolor resist is the same as the color of the first pixel color resist,the third color resist connects to the first pixel color resist, and awidth of the third color resist at the second direction is greater thanor equal to 1.5 times of the width of the first sub-pixel opening at thesecond direction.
 18. The electronic device of claim 15, wherein thecolor of the second color resist is different from the color of thefirst color resist, and the color of the second pixel color resist isdifferent from the color of the first pixel color resist.
 19. Theelectronic device of claim 11, wherein the black matrix layer comprisesplural first pixel regions and plural first shielding regionsalternately disposed along the first direction.
 20. The electronicdevice of claim 15, wherein the width of the first color resist and thewidth of the second color resist at the first direction is equal to orsmaller than a width of the first shielding region at the firstdirection.